Power chips are attached to outside circuits via product packaging, and their efficiency depends on the assistance of the packaging. In high-power situations, power chips are generally packaged as power components. Chip affiliation describes the electrical link on the top surface of the chip, which is generally aluminum bonding cable in conventional modules. ^
Standard power module plan cross-section

Today, industrial silicon carbide power modules still mainly make use of the packaging modern technology of this wire-bonded conventional silicon IGBT module. They deal with troubles such as big high-frequency parasitic parameters, not enough warm dissipation ability, low-temperature resistance, and insufficient insulation toughness, which limit using silicon carbide semiconductors. The screen of exceptional performance. In order to solve these issues and completely make use of the massive potential benefits of silicon carbide chips, several brand-new packaging innovations and services for silicon carbide power components have actually emerged in the last few years.

Silicon carbide power module bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have created from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold wires to copper cables, and the driving pressure is price reduction; high-power devices have actually developed from aluminum wires (strips) to Cu Clips, and the driving pressure is to improve product performance. The better the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a solid copper bridge soldered to solder to connect chips and pins. Compared with conventional bonding product packaging approaches, Cu Clip technology has the complying with advantages:

1. The connection in between the chip and the pins is made of copper sheets, which, to a certain level, changes the standard cable bonding technique in between the chip and the pins. Therefore, a special package resistance value, greater current circulation, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not need to be silver-plated, which can totally conserve the cost of silver plating and inadequate silver plating.

3. The product appearance is completely consistent with typical items and is mainly utilized in servers, mobile computers, batteries/drives, graphics cards, motors, power materials, and various other areas.

Cu Clip has two bonding methods.

All copper sheet bonding approach

Both the Gate pad and the Resource pad are clip-based. This bonding approach is much more expensive and complex, however it can achieve much better Rdson and much better thermal results.

( copper strip)

Copper sheet plus cable bonding technique

The resource pad utilizes a Clip approach, and eviction uses a Cable method. This bonding approach is a little cheaper than the all-copper bonding technique, conserving wafer location (suitable to very tiny gateway locations). The process is simpler than the all-copper bonding technique and can get far better Rdson and better thermal impact.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper solder, please feel free to contact us and send an inquiry.

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